Calibre 3DThermal performs highly accurate and computationally efficient thermal analysis throughout the IC design flow. With Calibre 3DThermal, designers of 3DICs now have an integrated chip-package thermal co-design flow that spans early-stage feasibility analysis through to design sign-off.
Thermal is the largest multi-physics barrier to successful 3DICs. The Calibre 3DThermal tool offers accurate and easy-to-use analysis of thermal behavior in the dies and in the package and is fully integrated into the IC design flow
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We help you adopt, deploy, customize and optimize your complex design environments. Direct access to engineering and product development lets us tap into deep domain and subject matter expertise.
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Across all process nodes and design styles, the Calibre toolsuite delivers accurate, efficient, comprehensive IC verification and optimization, while minimizing resource usage and tapeout schedules.