Overview
Calibre 3DThermal
Calibre 3DThermal performs highly accurate and computationally efficient thermal analysis throughout the IC design flow. With Calibre 3DThermal, designers of 3DICs now have an integrated chip-package thermal co-design flow that spans early-stage feasibility analysis through to design sign-off.
Ensure 3D IC design performance and reliability
Thermal is the largest multi-physics barrier to successful 3D ICs. The Calibre 3DThermal tool offers accurate and easy-to-use analysis of thermal behavior in the dies and in the package and is fully integrated into the IC design flow.
Industry-leading thermal solver
Calibre 3DThermal embeds an optimized custom 3D solver of the leading electronics thermal analysis tool, Simcenter Flotherm, into the proven Calibre platform to achieve highly accurate and computationally efficient analysis.
Advanced automation
Thermal analysis is new to many 3D IC designers. Calibre 3DThermal simplifies the flow by embedding expertise, like automatic equivalent thermal properties generation, gridding, time step generation and power map compression.
Full design flow support
The Calibre 3DThermal tool seamlessly integrates with other IC design and P&R tools and with other 3D IC solutions from Siemens. It is compatible with all 2D, 2.5D and 3D integration technologies.
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Design with Calibre blog
Across all process nodes and design styles, the Calibre tool suite delivers accurate, efficient, comprehensive IC verification and optimization, while minimizing resource usage and tapeout schedules.