Calibre 3DThermal

Calibre 3DThermal performs highly accurate and computationally efficient thermal analysis throughout the IC design flow. With Calibre 3DThermal, designers of 3DICs now have an integrated chip-package thermal co-design flow that spans early-stage feasibility analysis through to design sign-off.

Key features

Ensure 3DIC design performance and reliability

Thermal is the largest multi-physics barrier to successful 3DICs. The Calibre 3DThermal tool offers accurate and easy-to-use analysis of thermal behavior in the dies and in the package and is fully integrated into the IC design flow

Accuracy and performance

Industry-leading thermal solver

Calibre 3DThermal embeds an optimized custom 3D solver of the leading electronics thermal analysis tool, Simcenter Flotherm, into the proven Calibre platform to achieve highly accurate and computationally efficient analysis.

Ease-of-use

Advanced automation

Thermal analysis is new to many 3DIC designers. Calibre 3DThermal simplifies the flow by embedding expertise, like automatic equivalent thermal properties generation, gridding, time step generation and power map compression.

Integration and interoperability

Full design flow support

The Calibre 3DThermal tool seamlessly integrates with other IC design and P&R tools and with other 3DIC solutions from Siemens. It is compatible with all 2D, 2.5D and 3D integration technologies.

Calibre 3DThermal featured resources

Explore our featured resources or visit the full Calibre 3DThermal resource library to view on-demand webinars, white papers and fact sheets.

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