What's new in Xpedition IC Packaging VX.2.14

This release delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities now available.

Key new capabilities and features

Watch this short introduction overview video compilation.

What's new in IC Packaging

Watch narrated videos of the key new capabilities and features of Xpediton Substrate Integrator (xSI) and Xpedition Package Designer (xPD)

XSI: Copy/paste signal enhancements

Key new capabilities for VX.2.14

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XSI: Copy/paste signal enhancements

(2 mins, 8 secs)


XSI: Fiducials and component alignment

(2 mins, 32 secs)


XSI: Mechanical cells

(1 min, 23 secs)


XSI: Dual sided die/passive interposers

(1 min, 26 secs)


XSI:  Interactive sketch planning and editing

(1 min, 26 secs)


XPD: Route escapes for sketch plans

(33 secs)


XPD: Solder mask import via ODB++

(27 secs)

Fact sheet

Xpedition IC Packaging Whats New fact sheet

Read about the key new capabilities and features in VX.2.14

ic packaging, an image of a chip in the center of a computer motherboard highlighted in light blue.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.