This release delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities now available.
Watch this short introduction overview video compilation.
Watch narrated videos of the key new capabilities and features of Xpediton Substrate Integrator (xSI) and Xpedition Package Designer (xPD)
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Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.