What's new in Xpedition IC Packaging VX.2.14
This release delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities now available.
Key new capabilities and features
Watch this short introduction overview video compilation.
What's new in IC Packaging
Watch narrated videos of the key new capabilities and features of Xpediton Substrate Integrator (xSI) and Xpedition Package Designer (xPD)
Key new capabilities for VX.2.14
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Key new capabilities for VX.2.14
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XSI: Copy/paste signal enhancements
(2 mins, 8 secs)
XSI: Fiducials and component alignment
(2 mins, 32 secs)
XSI: Mechanical cells
(1 min, 23 secs)
XSI: Dual sided die/passive interposers
(1 min, 26 secs)
XSI: Interactive sketch planning and editing
(1 min, 26 secs)
XPD: Route escapes for sketch plans
(33 secs)
XPD: Solder mask import via ODB++
(27 secs)
Xpedition IC Packaging Whats New fact sheet
Read about the key new capabilities and features in VX.2.14
Download the release
Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.