What's new in Xpedition IC Packaging VX.2.13

Xpedition IC Packaging VX.2.13 delivers capabilities targeting heterogeneous integration
and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.13 release.

Key new capabilities

Watch this short overview of the key new capabilities

What's new in IC Packaging VX.2.13

Watch narrated videos of the key new capabilities in Xpedition Substrate Integrator (xSI) and Xpedition Package Designer (xPD)

IC Packaging VX 2.13 User Layers

New capability videos for VX.2.13

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IC Packaging VX 2.13 User Layers

(1 min, 39 secs)


IC Packaging VX 2.13 Plane Shapes Xsi

(1 min, 24 secs)


IC Packaging VX 2.13 Smart Pins

(3 mins, 1 sec)


IC Packaging VX 2.13 Import Export Complex Vias

(1 min, 39 secs)


IC Packaging VX 2.13 Improved Curved Traces

(38 secs)

Fact sheet

Xpedition IC Packaging VX.2.13 fact sheet

Learn about the key capabilities in the Xpedition IC Packaging VX.2.13 release in this fact sheet.

ic packaging, an image of a chip in the center of a computer motherboard highlighted in light blue.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.