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What’s New in Xpedition IC Packaging- VX.2.10 Update 3

The VX.2.10 Update 3 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages, including support for ultra-high pin count devices, predictive SI/PI analysis during prototyping and planning, and mixed vendor design flows.

Watch the Overview Video

Watch some of the new capabilities in this short video.

What's New in IC Packaging VX.2.10 Update 3

Watch narrated videos of selected new capabilities.

Data Path Planning in XSI ​

IC Packaging VX.2.10 Update 3 Videos

1 / 3


Data Path Planning in XSI ​

(1 min, 4 secs)


Hierarchical Device Planning: Create device from Floorplan ​

(1 min, 20 secs)


System Verilog integration

(59 secs)

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.