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What’s New in Xpedition IC Packaging- VX.2.10 Update 3

The VX.2.10 Update 3 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages, including support for ultra-high pin count devices, predictive SI/PI analysis during prototyping and planning, and mixed vendor design flows.

Watch the Overview Video

Watch some of the new capabilities in this short video.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.