What’s New in Xpedition IC Packaging- VX.2.10 Update 1
The VX.2.10 Update1 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages, including support for ultra-high pin count devices, predictive SI/PI analysis during prototyping and planning, and mixed vendor design flows.
Watch the Overview Video
Watch some of the new capabilities in this short video.
What's New in IC Packaging VX.2.10 Update 1
Watch narrated videos of selected new capabilities.
IC Packaging VX.2.10 Update 1 Videos
1 / 3
IC Packaging VX.2.10 Update 1 Videos
1 / 3
Auto color pin regions and apply user defined region usage identification during device creation
(1 min, 37 secs)
Ability to select nets that span devices and substrate level and export entire system-level path for SI/PI analysis
(1 min, 6 secs)
Multi-axis measurement between pin regions and device bumps helps minimize floorplan area
(52 secs)
Download the release
Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.