The Innovator3D IC solution suite enables the design and heterogeneous integration of chiplets. The solution suite contains four technologies: Innovator3D IC integrator, Innovator3D IC layout, Innovator3D IC protocol analyzer and Innovator3D IC data management.
The solution suite is designed to help companies predictably achieve their design and market window schedules by removing the barriers of design complexity that impact design cycles thereby accelerating designer productivity.
Innovator3D IC Integrator delivers a path for planning and heterogeneous integration of ASICs and chiplets using the latest semiconductor packaging, 2.5D and 3D technology platforms and substrates.
Innovator3D IC Layout provides a concurrent multi-user detailed constraint and rules driven physical implementation and manufacturing handoff.
Innovator3D IC Protocol Analyzer performs both standards-based interconnect compliance analysis and vendor model-based IBIS-AMI simulation for Universal Chiplet Interconnect Express (UCIe) high-speed serial links.
Innovator3D IC Data Management provides a capability that addresses design complexity, collaboration, reliability and quality plus design intellectual property (IP) management.
This core managed workflow delivers the ability to create differentiated products while meeting time-to-market goals through a collaborative, secure and managed process.