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Innovator3D IC solutions suite

An integrated suite of technologies using a digital-twin data model targeted at the core workflow of 2.5/3D heterogeneous integration of semiconductors.

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Innovator3D IC solution suite overview

Create breakthrough designs while meeting time-to-market goals through a collaborative, secure, and managed process.

  • Plan system-level designs using the 3D digital twin cockpit
  • Realize designs that meet power performance area (PPA) and cost in the shortest predictable timeframe
  • Analyze thermal and electrical characteristics pre-implementation
  • Verify system-level functionality and physical interfaces
featured capabilities

Remove barriers of complexity, accelerate productivy

i3D UX4

AI-infused user experience

Query your design data using natural language commands to get instant, cross-domain results. Identify critical interference issues while your AI assistant automatically filters false positives. Leverage intelligent search to find related design elements across your entire project. Approve or modify AI-suggested design classifications with a single click, and receive proactive recommendations based on your working preferences. Navigate complex 3D IC designs more efficiently as the system learns from your interactions and automatically highlights potential issues before they become problems.

True 3D digital twin

Transform your 3D IC design process by leveraging a complete digital twin "blueprint" that represents your entire device assembly in a hierarchical 3D model. Optimize your system's power, performance, area, and cost through
predictive analysis before physical implementation. Execute multi-physics analysis and modeling seamlessly with integrated tools like Calibre, HyperLynx, and Simcenter to validate designs early. Eliminate costly iterations by visualizing and interacting with all interconnect levels in one holistic environment.

i3DI screenshot 3D
i3D PA 3DEM-1280x720

Streamline compliance and IP management

Achieve UCIe protocol compliance efficiently through automated pre-route predictive analysis and integrated 3D EM modeling. Leverage standards-based interconnect compliance analysis and vendor model-based IBIS-AMI simulation for high-speed serial links.

Access your project data instantly through a centralized information hub that automatically extracts and analyzes design data at check-in. Set up channel speed, modulation, stimulus encoding, and metric reporting automatically for both compliance analysis and IBIS-AMI simulation, while maintaining secure version control of all design source IP.

demo video

3Dblox support

This demo video will show 3Dblox being imported into Innovator3D IC. Next you will see how to make an edit and then how to export and re-import to see the change. You can learn more about 3Dblox and even request access to a workshop by visiting our resource page.

“For advanced heterogeneous integration platforms such as EMIB, an integrated floorplanning and prototyping cockpit with predictive analysis is essential. Through our collaboration with Siemens EDA, we see Innovator3D IC as an important design technology component for our advanced integration platforms.”
Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry

Explore resources and related products

Watch

Demo | How Innovator3D IC reads and writes 3Dblox

Video | A 3D InCites award-winning solution

Listen

Podcast | From 2.5D to true 3D IC: What's driving the next wave of integration

Podcast | Why 3D ICs Need a Mindset Shift—and How to Make It Happen

Read

Brochure | Innovator3D IC solution suite

eBook series | Your guide to successful heterogeneous integration