High Density Advanced Packaging (HDAP)

30-day trials

Explore the differentiated capabilities of the Xpedition and Calibre technologies in these self-contained cloud hosted virtual laboratories.

High density advanced packaging (HDAP) product trials

Screenshot of IC Package Prototyping software.

IC package prototyping trial

Xpedition Substrate Integrator

An IC Package Prototyping product helps rapidly integrate die/chiplets, interposers and packages from different processes and suppliers. Explore how rapid prototyping drives early predictive electrical and thermal analysis!

Calibre 3DSTACK trial

Get started with Calibre 3DSTACK today

Find out how the Calibre 3DSTACK environment enables you to perform physical verification on your multi-die package to fully check connectivity and critical DRC violations.

Xpedition Package Designer

Migrate Cadence APD and SiP data

Find out how to migrate Cadence ADP and SiP data to Xpedition Package Designer with ease by signing up for our free trial today!

Illustration of a hardware chip with circuits.

Xpedition Package Designer

Explore advanced IC Package substrate design

Explore advanced IC Package substrate design with Xpedition Package Designer and experience the fastest path to implementation.

Xpedition Substrate Integrator

Designing a 2.5D silicon interposer trial

Design a silicon interposer containing a system-on-chip (SOC) connected to high-bandwidth memories (HBMs) using the Xpedition Substrate Integrator and Xpedition Package Designer.

Layout of a virtual semiconductor die chip.

Virtual die design flow trial

Building a virtual semiconductor die using LEF/DEF

Learn how to use LEF/DEF die information to build a virtual semiconductor die and perform an ECO using Xpedition Substrate Integrator.

XPEDITION SUBSTRATE INTEGRATOR

Semiconductor die bump planning process flow trial

Learn how to quickly create die/chiplet bump plans and assign signals during advanced IC package floorplanning.

Deepen your HDAP knowledge

Customer Support

Siemens offers world-class customer support for all IC Packaging products. Get in touch with us today.

Learn more

IC Packaging blog

Keep up with the latest news and highlights for IC Packaging software.

Learn more

Contact us

Speak with an IC Packaging expert and get answers to all of your IC Packaging software questions.