Semiconductor packaging best practices
IC packaging design capacity support and performance
As multi-chiplet/ASIC designs scale into multi-million pin assemblies, it is crucial that the IC packaging tools can handle this capacity while still delivering productivity and usability.
Efficient million pin plus IC packaging design support
Today's multi chiplet/ASIC packages typically use substrates for high-speed integration and package BGAs for connection to the PCB. This assembly often exceeds a million or more total pins. It is crucial that your IC packaging tools can handle the capacity and deliver productivity and usability.
Support for capacity and performance
Xpedition Substrate Integrator and Xpedition Package Designer have been architected to deliver productivity performance on million pin plus designs.
IC packaging design capacity support and performance
Learn more about IC packaging designer productivity and efficiency capabilities and benefits.
Rapid creation of million pin die for planning
Performance and design capacity support for the prototyping and planning of ultra-high pin count designs. Watch how a 1 million pin device with 4000-pin regions takes less than 30 seconds to construct.