This standard defines a modular, hierarchical syntax and rules for describing components and their connectivity in 2.5D/3D advanced packaging, including chiplets, interposers, and substrates. Enhancing the 3Dblox language, it provides high-level descriptions of component size, orientation, interface, thickness, interconnect regions, structures, and other integration-critical properties. Designed for chiplet makers, 2.5D/3D packagers, and end users, this language streamlines component representation for advanced packaging. Learn more.