3Dblox resources

There is a lot of industry buzz about 3Dblox. TSMC is talking about it, the OSATs are talking about it, EDA is talking about it and semiconductor designers are talking about it, so take a deeper look by exploring the resources and downloads below.

IEEE P3537

Standard for 3Dblox--Chiplet Connectivity and Physical Properties Description Language

This standard defines a modular, hierarchical syntax and rules for describing components and their connectivity in 2.5D/3D advanced packaging, including chiplets, interposers, and substrates. Enhancing the 3Dblox language, it provides high-level descriptions of component size, orientation, interface, thickness, interconnect regions, structures, and other integration-critical properties. Designed for chiplet makers, 2.5D/3D packagers, and end users, this language streamlines component representation for advanced packaging. Learn more.