Calibre Manufacturing at SPIE Advanced Lithography 2023

27 February 2023 • 10:50 AM - 11:10 AM
Structured assist features in inverse lithography
Paper 12495-2

27 February 2023 • 4:20 PM - 4:40 PM
Resolution enhancement techniques @0.55 NA EUV applied for 6th generation of 10nm DRAM Joint paper of IMEC and Siemens EDA
Paper 12495-9

28 February 2023 • 1:40 PM - 2:10 PM
Extending design technology co-optimization from technology launch to HVM (Keynote Presentation)
Paper 12495-14

28 February 2023 • 3:40 PM - 4:10 PM
EUV Full-chip curvilinear mask options for logic via and metal patterning (Invited Paper)
Paper 12495-18

1 March 2023 • 10:30 AM - 10:50 AM
Stochastic aware EUV OPC on random logic via Joint paper of IMEC and Siemens EDA
Paper 12494-26

1 March 2023 • 10:50 AM - 11:10 AM
A ML based OPC model pattern down-selection method with mask and wafer contours
Paper 12499-17

1 March 2023 • 1:20 PM - 1:40 PM
IC layouts patterns topological profiling using directional geometrical kernels Joint paper of Ain Shams University and Siemens EDA
Paper 12495-29

1 March 2023 • 5:30 PM - 7:00 PM
CPU time prediction using machine learning for post-tapeout flow runs (PTOF)
Paper 12495-64

1 March 2023 • 5:30 PM - 7:00 PM
Design-aware virtual metrology and process recipe recommendation Joint paper of GlobalFoundries and Siemens EDA
Paper 12495-75

1 March 2023 • 5:30 PM - 7:00 PM
Impact of mask rule constraints on ideal SRAF placement
Paper 12494-54

1 March 2023 • 5:30 PM - 7:00 PM
EUV SRAFs printing modeling and verification in 2D hole array Joint paper of IMEC and Siemens EDA
Paper 12494-61

1 March 2023 • 5:30 PM - 7:00 PM
Design rule manual and DRC code qualification flows empowered by high coverage synthetic layouts generation Joint paper of SAMSUNG Electronics and Siemens EDA
Paper 12495-72

1 March 2023 • 5:30 PM - 7:00 PM
Application of Gaussian Random Field EUV stochastic model to quantification of stochastic variability of EUV vias Joint paper of IMEC and Siemens EDA
Paper 12494-67

1 March 2023 • 5:30 PM - 7:00 PM
AI-guided reliability diagnosis for 5,7nm automotive process Joint paper of SAMSUNG Electronics and Siemens EDA
Paper 12496-142

1 March 2023 • 5:30 PM - 7:00 PM
Hybrid deep learning OPC framework with generative adversarial network Joint paper of Institute of Microelectronics, Beijing Superstring Academy of Memory Technology, and Siemens EDA
Paper 12495-69