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Steffen Schulze, VP, Product Management Calibre Semiconductor Solutions, Siemens EDA
Join Calibre IC Manufacturing at SPIE Advanced Lithography 2024, Feb. 25 - 29, at the San Jose Convention Center. Siemens will be presenting 18 papers. (All presentations are listed in Pacific Time.)
Feb. 28, 2024 • 10:30 a.m. - 10:55 a.m.
An artificial intelligence machine leaning (AI/ML) approach with cross-technology node learning for multi-layer process defect predictions (Invited Paper)
Paper 12954-14
Feb. 28, 2024 • 11:10 a.m. - 11:35 a.m.
Machine learning (ML) based SEM contour extraction accelerated by GPU for etch modeling application (Invited Paper)
Paper 12958-25
Feb. 28, 2024 • 11:10 a.m. - 11:35 a.m.
OPC and modeling solution towards 0.55na EUV stitching
Paper 12953-29
Feb. 28, 2024 • 2 p.m. - 2:20 p.m.
Low landing energy as an enabler for optimal contour based OPC modeling in the EUV era
Paper 12955-39
Feb. 28, 2024 • 2:25 p.m. - 2:45 p.m.
Improving OPC model accuracy of dry resist for low k1 EUV patterning
Paper 12954-21
Feb. 28, 2024 • 3:25 p.m. - 3:45 p.m.
Cloud flight plan for post-tapeout flow jobs
Paper 12954-24
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
Advanced process control by machine learning based virtual metrology for high product mix manufacturing
Paper 12955-74
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
Using machine learning method to improve design sampling efficiency for fab applications
Paper 12954-46
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
Towards efficient and accurate cost functions for EUVL stochastic-aware OPC correction and verification: via failure probability versus image and process variation band metrics
Paper 12953-72
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
The effect of edge placement error on deformity and roughness calculation
Paper 12955-117
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
Fast and accurate automatic wafer defect detection and classification using machine learning based SEM image analysis
Paper 12955-133
Feb. 28, 2024 • 5:30 p.m. - 7 p.m.
Contour metrology for process matching and OPC qualification with machine learning-based site selection
Paper 12955-134
Feb. 29, 2024 • 10:30 a.m. - 10:55 a.m.
Layout simulation for directed self-assembly with chemo-epitaxy methodology
Paper 12954-30
Feb. 29, 2024 • 11:30 a.m.- 11:50 a.m.
Principal components and optimal feature vectors of EUVL stochastic variability: applications of Karhunen-Loève Expansion to efficient estimation of stochastic failure probabilities and stochastic metrics
Paper 12957-47
Feb. 29, 2024 • 1:45 p.m. - 2:05 p.m.
A new era DFM solution for yield enhancement using machine learning
Paper 12954-35
Feb. 29, 2024 • 3:45 p.m. - 4:05 p.m.
An integrated verification flow for curvilinear mask
Paper 12954-39
Feb. 29, 2024 • 4:25 p.m. - 4:45 p.m.
Fast full chip curvilinear MRC for advanced manufacturing nodes
Paper 12954-41
Feb. 29, 2024 • 4:45 p.m. - 5:05 p.m.
Model-based OPC using the MEEF matrix III
Paper 12954-42
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