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{"heading":"Addressing Engineering Challenges","shareURL":"https://eda.sw.siemens.com/en-US/pcb/critical-engineering-challenges/","children":"<p>Dealing with increasing systems complexity requires a complete PCB systems design flow covering multi-board definition, design capture, high-density advanced packaging, electro-mechanical co-design, physical layout, verification, and streamlined hand-off to manufacturing.</p>"}

Addressing Engineering Challenges

<p>Dealing with increasing systems complexity requires a complete PCB systems design flow covering multi-board definition, design capture, high-density advanced packaging, electro-mechanical co-design, physical layout, verification, and streamlined hand-off to manufacturing.</p>
{"headingSize":"heading2","parentCard":{"cardTitle":"A Digital Strategy","cardDescription":"To achieve a digital transformation, the following must be enabled: multi-discipline systems engineering, concurrent design, process automation, design data integrity and design verification.","imgUrl":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/7ECqe0xwxKZYS36r5rIDqc/en-US/Layout_EBSD_PCB_Assembly_106.jpg?w=640&q=60","childCards":[{"cardTitle":"Multi-Discipline Systems Engineering","cardDescription":"Xpedition delivers integration, collaboration, and co-design systems between IC packaging, multi-board, RF, harness, FPGA, and MCAD.","cardLink":"/en-US/pcb/critical-engineering-challenges/multi-discipline/","linkData":"{\"name\":\"ECAD-MCAD-640x360\",\"id\":\"1zXeSaOlnoxZ5v4qeXVMiC\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Concurrent Design","cardDescription":"Electronic design companies are continually faced with getting products to market faster with reduced costs. To be a first-to-market company you need collaboration and co-design systems.","cardLink":"/en-US/pcb/critical-engineering-challenges/concurrent-design"},{"cardTitle":"Process Automation ","cardDescription":"Lowering electronic product development costs and meeting delivery dates are the top challenges faced by best-in-class companies. Meeting these challenges requires design flow automation.","cardLink":"/en-US/pcb/critical-engineering-challenges/process-automation/"},{"cardTitle":"Design Data Integrity ","cardDescription":"Engineering teams face challenges associated with the creation, reliability and management of design data throughout product design. To succeed you need to leverage and manage library and design data.","cardLink":"/en-US/pcb/critical-engineering-challenges/design-data-integrity/","linkData":"{\"name\":\"Optimize engineering data management 640x480\",\"id\":\"59q0umO6pEbKyIhSavgzjt\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Design Verification","cardDescription":"The pressure to get electronics products to market quickly. You need to shift verification technologies earlier in the process to enable you to deliver products \"right to market, first time.\"","cardLink":"/en-US/pcb/critical-engineering-challenges/design-verification/"}]},"childCards":[{"cardTitle":"Multi-Discipline Systems Engineering","cardDescription":"Xpedition delivers integration, collaboration, and co-design systems between IC packaging, multi-board, RF, harness, FPGA, and MCAD.","cardLink":"/en-US/pcb/critical-engineering-challenges/multi-discipline/","linkData":"{\"name\":\"ECAD-MCAD-640x360\",\"id\":\"1zXeSaOlnoxZ5v4qeXVMiC\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Concurrent Design","cardDescription":"Electronic design companies are continually faced with getting products to market faster with reduced costs. To be a first-to-market company you need collaboration and co-design systems.","cardLink":"/en-US/pcb/critical-engineering-challenges/concurrent-design"},{"cardTitle":"Process Automation ","cardDescription":"Lowering electronic product development costs and meeting delivery dates are the top challenges faced by best-in-class companies. Meeting these challenges requires design flow automation.","cardLink":"/en-US/pcb/critical-engineering-challenges/process-automation/"},{"cardTitle":"Design Data Integrity ","cardDescription":"Engineering teams face challenges associated with the creation, reliability and management of design data throughout product design. To succeed you need to leverage and manage library and design data.","cardLink":"/en-US/pcb/critical-engineering-challenges/design-data-integrity/","linkData":"{\"name\":\"Optimize engineering data management 640x480\",\"id\":\"59q0umO6pEbKyIhSavgzjt\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Design Verification","cardDescription":"The pressure to get electronics products to market quickly. You need to shift verification technologies earlier in the process to enable you to deliver products \"right to market, first time.\"","cardLink":"/en-US/pcb/critical-engineering-challenges/design-verification/"}]}