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{"heading":"Package Signoff with Calibre & HyperLynx","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/software/package-signoff/features/","children":"<p>Design verification of multiple die and substrate assemblies by identifying geometries per layer per die placement in the assembly. DRC and LVS is performed on the interface geometries with support for dies from multiple processes.</p>"}

Package Signoff with Calibre & HyperLynx

<p>Design verification of multiple die and substrate assemblies by identifying geometries per layer per die placement in the assembly. DRC and LVS is performed on the interface geometries with support for dies from multiple processes.</p>
{"items":[{"title":"Shift-left in-design Fabrication DRC","description":"<p>Next-generation packaging solutions require proven, automated sign-off for physical, electrical, thermal, and manufacturing performance within a single environment that enables designers to manage all of these processes in an efficient, repeatable, and automated flow. Utilizing Calibre and HyperLynx for verification, designers can both identify and resolve problems before final sign-off.</p>","button":{"text":"Watch Video ","url":"https://resources.sw.siemens.com/en-US/technology-overview-hyperlynx-drc-overview"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/2Iz7VpUx4MFOSAdMKpkuHX/en-US/shift-left-in-design-fabrication-drc-promo-640x480.jpg?w=640&q=60","imageAlt":"shift-left-in-design fabrication drc","imageTitle":"shift-left-in-design fabrication drc","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Foundry/OSAT Rules-driven Substrate Metal Verification","description":"<p>Equation-based DRC technology (eqDRC) brings user extensibility and fast runtimes to a whole host of complex design and process interactions. eqDRC enables precise and accurate characterizations of complex, multi-variable, and non-Manhattan geometries, as well as 2D/3D interactions that have a direct impact on performance and/or manufacturability.</br></br></br></br></p>","button":{"text":"Read Fact Sheet","url":"https://resources.sw.siemens.com/en-US/fact-sheet-calibre-eqdrc"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/6v14n1Tfp2FA14U7NQPcnG/en-US/foundry-osat-promo-640x480.jpg?w=640&q=60","imageAlt":"Foundry/OSAT image","imageTitle":"Foundry/OSAT image","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Signoff Verification of 2.5/3D Stacked Die Assemblies","description":"<p>Provides complete design verification of stacked die assemblies. Delivers 3D assembly LVS for assemblies such as stacked memories, stacked sensor arrays, interposer-based structures, or package-level RDL routing. Errors/issues cross probed directly into design for immediate attention. Driven by the Xpedition Substrate Integrators 3D assembly model.</br></br></br></br></p>","button":{"text":"Watch Video","url":"https://resources.sw.siemens.com/en-US/technology-overview-xsi-3dstack-for-2-5d-3d-assembly-verification"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/7iMWasG9C1BjqWwfIFLlt1/en-US/signoff-verification-promo-640x480.jpg?w=640&q=60","imageAlt":"Signoff_verification image","imageTitle":"Signoff_verification image","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Intra-die & Inter-die Parasitic Extraction","description":"<p>Maximize your design to manufacturing efficiencies by leveraging the integration with Valor technology.  Identify potential manufacturing issues while you are still in the organic substrate design stage. And to further streamline the process, you can define various stages of the design process, each with their own list of DFM checks relevant to that stage.</p><p></br></br></br></br></br></br></p>","button":{"text":"Read White Paper","url":"https://resources.sw.siemens.com/en-US/white-paper-advancing-the-art-of-parasitic-extraction-the-calibre-xact-platform"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/5fdbaDyZ2nyVXYrdMQsn6w/en-US/intra-die-inter-die-parasitic-extraction-promo-640x480.jpg?w=640&q=60","imageAlt":"Intra-die Images","imageTitle":"Intra-die Images","rightIcon":"fal fa-long-arrow-right fa-lg"}],"env":"master","locale":"en-US"}

Shift-left in-design Fabrication DRC

<p>Next-generation packaging solutions require proven, automated sign-off for physical, electrical, thermal, and manufacturing performance within a single environment that enables designers to manage all of these processes in an efficient, repeatable, and automated flow. Utilizing Calibre and HyperLynx for verification, designers can both identify and resolve problems before final sign-off.</p>

shift-left-in-design fabrication drc

Foundry/OSAT Rules-driven Substrate Metal Verification

<p>Equation-based DRC technology (eqDRC) brings user extensibility and fast runtimes to a whole host of complex design and process interactions. eqDRC enables precise and accurate characterizations of complex, multi-variable, and non-Manhattan geometries, as well as 2D/3D interactions that have a direct impact on performance and/or manufacturability.</br></br></br></br></p>

Foundry/OSAT image

Signoff Verification of 2.5/3D Stacked Die Assemblies

<p>Provides complete design verification of stacked die assemblies. Delivers 3D assembly LVS for assemblies such as stacked memories, stacked sensor arrays, interposer-based structures, or package-level RDL routing. Errors/issues cross probed directly into design for immediate attention. Driven by the Xpedition Substrate Integrators 3D assembly model.</br></br></br></br></p>

Signoff_verification image

Intra-die & Inter-die Parasitic Extraction

<p>Maximize your design to manufacturing efficiencies by leveraging the integration with Valor technology.  Identify potential manufacturing issues while you are still in the organic substrate design stage. And to further streamline the process, you can define various stages of the design process, each with their own list of DFM checks relevant to that stage.</p><p></br></br></br></br></br></br></p>

Intra-die Images