Siemens EDA at GOMACTech
March 17-20, 2025
Pasadena Convention Center
Pasadena, CA, USA
Visit our exhibit booth (505) and attend our poster and technical sessions to learn how Siemens EDA can help you engineer a smarter future faster.
Emerging Technologies Poster Session
Improving Productivity with Parallel Simulation (Poster P.9)
Thursday, March 20, 10:30 - 12:00 PM / Exhibit Hall
Jonathan Stanley, Siemens EDA
Shuying Qi, Siemens EDA
Technical Session
Enabling the ecosystem of true heterogeneous 3D IC designs (Session 8.1)
Tuesday, March 18 / 3:30 – 5:10 PM / Ballroom B
Part of Session 8 - Advances in Modeling for Package Design
Anthony Mastroianni, Siemens EDA
Technical Session
An Integrated Approach to Advanced 2.5D/3D Package Thermal Design:
Enhancing Collaboration and Efficiency (Session 8.4)
Tuesday, March 18 / 3:30 - 5:10PM / Ballroom B
Part of Session 8 - Advances in Modeling for Package Design
Andras Vass-Varnai, Siemens EDA
Subramanian Lalgudi, Siemens EDA
Tatiana Trebunskiskh, Siemens PLM
Alex Strickland, Siemens EDA
Technical Session
Thermal Test Vehicles for Characterization of Next Generation Heterogenous
Packaging Utilizing Glass Core Substrates (Session 28.1)
Wednesday, March 19 / 1:30 – 3:10 PM / Ballroom B
Part of Session 8 - Packaging, Integration, Thermal and Control Technologies
Joe Proulx, Siemens EDA
Technical Session
FPGA Safety and Security Policy Compliance via HDL-to-Bitstream
Equivalence Checking (Session 43.5)
Thursday, March 20 / 8:20 a.m. – 10 a.m. / Ballroom D&E
Part of Session 43 - Multidisciplinary Approaches to Security
Kevin Urish, John Hallman, Siemens EDA
